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Reduce short defects caused by micro solder balls! Flux cleaning agent.

Are you struggling with short defects caused by tiny solder balls? "Micro Clean ECO and Markless ECO," which support the improvement of product direct delivery rates, will solve this issue.

Unmissable measures against micro solder balls. Micro solder balls generated during the assembly process are difficult to detect during visual inspection and can lead to short defects and quality issues after shipment. This is particularly significant in high-density printed circuit boards, where the impact of fine foreign substances is substantial, and the removal performance during the cleaning process affects yield. Micro Clean ECO and Markless ECO support the removal process not only of flux residues but also of fine foreign substances and contaminants, thanks to their high permeability and replacement performance. They reduce the risk of residues after cleaning, contribute to alleviating the burden of inspection processes, and improve the direct shipment rate of products. They assist in reducing labor hours required for re-cleaning and re-inspection while achieving stable production quality.

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